JPS62638B2 - - Google Patents

Info

Publication number
JPS62638B2
JPS62638B2 JP52007082A JP708277A JPS62638B2 JP S62638 B2 JPS62638 B2 JP S62638B2 JP 52007082 A JP52007082 A JP 52007082A JP 708277 A JP708277 A JP 708277A JP S62638 B2 JPS62638 B2 JP S62638B2
Authority
JP
Japan
Prior art keywords
light
color filter
solid
light receiving
receiving section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52007082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5392621A (en
Inventor
Takamichi Wada
Yasuaki Terui
Masaru Yoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP708277A priority Critical patent/JPS5392621A/ja
Publication of JPS5392621A publication Critical patent/JPS5392621A/ja
Publication of JPS62638B2 publication Critical patent/JPS62638B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Light Receiving Elements (AREA)
  • Color Television Image Signal Generators (AREA)
JP708277A 1977-01-24 1977-01-24 Color solid image pickup unit Granted JPS5392621A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP708277A JPS5392621A (en) 1977-01-24 1977-01-24 Color solid image pickup unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP708277A JPS5392621A (en) 1977-01-24 1977-01-24 Color solid image pickup unit

Publications (2)

Publication Number Publication Date
JPS5392621A JPS5392621A (en) 1978-08-14
JPS62638B2 true JPS62638B2 (en]) 1987-01-08

Family

ID=11656156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP708277A Granted JPS5392621A (en) 1977-01-24 1977-01-24 Color solid image pickup unit

Country Status (1)

Country Link
JP (1) JPS5392621A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01157189U (en]) * 1988-04-20 1989-10-30

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710274A (en) * 1980-06-23 1982-01-19 Toshiba Corp Solid color imaging device
EP0565776B1 (en) * 1992-04-15 1997-03-19 Hewlett-Packard Company Color image sensing apparatus and method
JP3742422B1 (ja) 2005-03-17 2006-02-01 日立マクセル株式会社 扁平形電池

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157018A (en]) * 1974-06-08 1975-12-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01157189U (en]) * 1988-04-20 1989-10-30

Also Published As

Publication number Publication date
JPS5392621A (en) 1978-08-14

Similar Documents

Publication Publication Date Title
US5418566A (en) Compact imaging apparatus for electronic endoscope with improved optical characteristics
JPH06503683A (ja) 光学電子装置構成要素パッケージ及び該パッケージを製造する方法
US20220302094A1 (en) Optical sensor, and method for manufacturing optical sensor
CN109155292B (zh) 光学传感模组及其制作方法
JPS62638B2 (en])
US20010052640A1 (en) Solid image pickup device
JP3964899B2 (ja) 画像読み取り装置
WO2020034171A1 (zh) 光学传感模组及其制作方法
JPS62190776A (ja) 光電変換装置
EP0475370B1 (en) Compact imaging apparatus for electronic endoscope with improved optical characteristics
JPS59148372A (ja) 感光装置
JPH01191481A (ja) 受光素子
JPS6328351B2 (en])
JP2000133822A (ja) 光半導体装置
JP2958228B2 (ja) 透過型光結合装置
JPH0713038A (ja) 光パッケージ
JPH0211794Y2 (en])
JPS5910762Y2 (ja) 光結合半導体装置
JPS6025084Y2 (ja) 透光性樹脂材料によつて封入された発光素子
JPS62130560A (ja) 密着型イメ−ジセンサの構造
JPH0555537A (ja) 光学素子
JPS6334290Y2 (en])
JPS6328353B2 (en])
JPS597267B2 (ja) 固体撮像装置の製造方法
JPS62225065A (ja) 密着型イメ−ジセンサ